型号:

BBL-132-T-E

RoHS:无铅 / 符合
制造商:Samtec Inc描述:CONN HEADR LOPRO 32POS .100 TIN
详细参数
数值
产品分类 连接器,互连式 >> 板至板 - 接头,公引脚
BBL-132-T-E PDF
产品培训模块 Board-to-Board Connectors
产品目录绘图 BBL-xxx-G-E Series
特色产品 Board-To-Board Interconnect Systems
标准包装 1
系列 BBL
连接器类型 无罩
位置数 32
加载位置的数目 全部
间距 0.100"(2.54mm)
行数 1
行间距 -
高度堆叠(配接) -
超出电路板的模制高度 0.070"(1.78mm)
触点接合长度 0.105"(2.67mm)
安装类型 通孔
端子 焊接
触点表面涂层
触点涂层厚度 -
特点 -
颜色
包装 散装
配套产品 ESS-132-T-03-ND - CONN SOCKET .100" 32POS PCB GOLD
SAM1110-32-ND - CONN RCPT .100" 32POS TIN PCB
SAM1109-32-ND - CONN RCPT .100" 32POS TIN PCB
SAM1108-32-ND - CONN RCPT .100" 32POS TIN PCB
SAM1107-32-ND - CONN RCPT .100" 32POS GOLD PCB
SAM1106-32-ND - CONN RCPT .100" 32POS GOLD PCB
SAM1105-32-ND - CONN RCPT .100" 32POS GOLD PCB
SAM1104-32-ND - CONN RCPT .100" 32POS GOLD PCB
SAM1103-32-ND - CONN RCPT .100" 32POS GOLD PCB
SAM1102-32-ND - CONN RCPT .100" 32POS GOLD PCB
其它名称 SAM1002-32
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